DocumentCode :
3253284
Title :
Impingement air cooled plate fin heat sinks. Part II - Thermal resistance model
Author :
Duan, Zhipeng ; Mzychka, Y.S.
Author_Institution :
Fac. of Eng. & Appl. Sci., Memorial Univ. of Newfoundland, St. John´´s, Nfld., Canada
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
436
Abstract :
For pt.I, see ibid., vol.I, no., p.429-35 (2004). Impingement air cooling with heat sinks is one attractive solution in thermal management of electronic components. A simple impingement flow thermal resistance model based on developing laminar flow in rectangular channels is proposed. Experimental measurements of thermal resistance are performed with heat sinks of various impingement inlet widths, fin spacings, fin heights and airflow velocities to test the validity of the model. The accuracy of the predicted thermal resistance was found to be within 20% of the experimental data at channel Reynolds numbers less than 1200. The simple model is suitable for parametric design studies.
Keywords :
channel flow; cooling; flow simulation; heat sinks; laminar flow; thermal management (packaging); thermal resistance; Reynolds number; airflow velocity; electronic component; fin height; fin spacing; flow thermal resistance model; heat sink; impingement air cooling; impingement inlet width; laminar flow; rectangular channel; thermal management; Electrical resistance measurement; Electronic components; Electronics cooling; Heat sinks; Performance evaluation; Resistance heating; Thermal management; Thermal management of electronics; Thermal resistance; Velocity measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
Type :
conf
DOI :
10.1109/ITHERM.2004.1319207
Filename :
1319207
Link To Document :
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