DocumentCode
3253566
Title
Design, development, and evaluation of a tilt and soil moisture sensor network for slope monitoring applications
Author
De Dios, Rosanno JC ; Enriquez, Jason ; Victorino, Francis Gabriel ; Mendoza, Earl Anthony ; Talampas, Marc Caesar ; Marciano, J.J.
Author_Institution
Electr. & Electron. Eng. Inst., Univ. of the Philippines Diliman, Quezon City, Philippines
fYear
2009
fDate
23-26 Jan. 2009
Firstpage
1
Lastpage
6
Abstract
A sensor network consisting of sensors for slope deformation and soil-water content was designed, developed, and evaluated in a miniature slope model. The sensor network is buried vertically underground, and is composed of pipe segments to form a column. Each segment contains a tri-axial accelerometer for tilt measurements and capacitive-type sensors for soil moisture measurement. Measurements taken in each segment is accessed via Controller Area Network (CAN). The CAN master node located at the top of the column transfers the collected data from the slave nodes wirelessly to a base station via a WiFi link. Data was collected, stored, processed and displayed via the Python-based GUI on the base station. The entire system was tested and evaluated on a small-scale slope model. A slope failure was induced and the system was demonstrated to ably measure the inclination and soil moisture content throughout the landslide event.
Keywords
geomorphology; geophysical equipment; geophysical techniques; moisture; soil; wireless LAN; wireless sensor networks; CAN master node; Controller Area Network; Python-based GUI; WiFi link; capacitive-type sensors; landslide event; miniature slope model; pipe segments; slope deformation; slope failure; slope monitoring applications; soil moisture sensor network; soil-water content; tilt measurements; triaxial accelerometer; Accelerometers; Area measurement; Base stations; Capacitive sensors; Deformable models; Master-slave; Moisture measurement; Monitoring; Soil measurements; Soil moisture; early warning systems; sensor networks; slope monitoring;
fLanguage
English
Publisher
ieee
Conference_Titel
TENCON 2009 - 2009 IEEE Region 10 Conference
Conference_Location
Singapore
Print_ISBN
978-1-4244-4546-2
Electronic_ISBN
978-1-4244-4547-9
Type
conf
DOI
10.1109/TENCON.2009.5395926
Filename
5395926
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