DocumentCode :
3253568
Title :
Simplified modeling of complex heat exchanger systems
Author :
Zandi, Ben ; Lewis, Jeffrey ; Lewis, Hamish ; Severson, Mark
Author_Institution :
TES Intl., Troy, MI, USA
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
528
Abstract :
The goals of this paper are to develop and demonstrate an efficient modeling technique for the thermal analysis of compact heat exchangers for integration into more complex systems. The proposed simplified heat exchanger model can take advantage of an existing library of heat exchanger performance data, or alternatively, it can use existing heat exchanger performance curves. The ultimate utility of this methodology is to allow quick and accurate design decisions at system-level during package development by enabling the analyst to construct models and perform system-level thermal (and CFD) analyses in a matter of a few hours, rather than a few days (or weeks). The developed procedure has been demonstrated on a typical military aircraft electronics application, where the components are cooled by conduction of heat from the boards to "cold-plated" sidewalls. The proposed procedure is integrated into a thermal/CFD model of the above system. Heat transfer between the sidewall and the working fluid is modeled using a fluid network. Each section in the network denotes a heat exchanger section and is linked to a corresponding section of the coldplate through using the "UA" of the heat exchanger.
Keywords :
computational fluid dynamics; cooling; electronics packaging; heat conduction; heat exchangers; large-scale systems; military aircraft; thermal analysis; CFD; PCB; accurate design decision; cold plated sidewalls; compact heat exchangers; complex system; computational fluid dynamics; efficient modeling technique; fluid network; heat conduction; heat exchanger performance curves; heat transfer; military aircraft electronics application; package development; printed circuit board; system level thermal analysis; thermal analysis; working fluid; Computational fluid dynamics; Copper; Electronic packaging thermal management; Equations; Heat transfer; Libraries; Performance analysis; Solids; Temperature; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
Type :
conf
DOI :
10.1109/ITHERM.2004.1319219
Filename :
1319219
Link To Document :
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