Crosstalk in ultra-high-speed VLSI interconnects due to substrate-conductivity, temperature, and line-length effects

Author

Malisuwan, Settapong

Author_Institution

Dept. of Electr. Eng., Florida Atlantic Univ., Boca Raton, FL, USA

fYear

1999

fDate

1999

Firstpage

173

Lastpage

176

Abstract

Effects of substrate-conductivity, temperature, and line-length on crosstalk along ultra-high-speed VLSI interconnects are investigated. Results indicate that the crosstalk does not decrease monotonically with increasing linespacing and also the crosstalk tends to be more oscillatory when the line-length is increased. The crosstalk amplitude is significantly changed when temperature is varied between 265 to 280 Kelvin for 10-50 mm line-length. Furthermore, the crosstalk is eliminated when substrate-conductivity is greater than 0.14 Siemen/meter and temperature is less than 265 K

Keywords

VLSI; crosstalk; integrated circuit interconnections; very high speed integrated circuits; 10 to 50 mm; 265 to 280 K; crosstalk; line length; substrate conductivity; temperature dependence; ultra-high-speed VLSI interconnect; Crosstalk; Electromagnetic interference; Frequency; Impedance; Integrated circuit interconnections; Microstrip; Permittivity; Temperature; Transmission line theory; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Communications, Computers and Signal Processing, 1999 IEEE Pacific Rim Conference on

Conference_Location

Victoria, BC

Print_ISBN

0-7803-5582-2

Type

conf

DOI

10.1109/PACRIM.1999.799505

Filename

799505