DocumentCode :
3254750
Title :
A study on the effectiveness of different cap oxides for preventing fluorine out-diffusion from FSG
Author :
Chou, P.F. ; Cheng, Y.L.
Author_Institution :
Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan
fYear :
2001
fDate :
2001
Firstpage :
257
Lastpage :
260
Abstract :
In this paper, we investigate the effect of fluorine out-diffusion from fluorinated-silicate-glass (FSG) film stacks. The FSG film stack consists of 2 kÅ cap oxide/6 kÅ FSG/2 kÅ liner oxide. Different cap oxide and liner oxide materials were studied in this work. The samples were annealed at 410°C for several hours to simulate the various backend annealing processes. SIMS was used to measure the F distribution in the FSG film stack. We found that silicon nitride (SiNx) could effectively inhibit F diffusion from the FSG film. But this film stack was not stable under ion beam and electron beam irradiation. Plasma-Enhanced (PE) oxide cap on FSG film could not inhibit F diffusion from the FSG film very well, but it was stable under SIMS ion beam and electron beam irradiation. We also found that silicon rich oxide (SRO) inhibited F out-diffusion, and that the film stack was stable during SIMS analysis. Why does SRO inhibit F out-diffusion? From the SIMS results, we found N in the SRO film. Furthermore, the higher the concentration of N in the SRO film, the less the F diffused out. A series of experiments were carried out to study the effect of introducing nitrogen in both SRO and FSG in preventing F out-diffusion from FSG
Keywords :
annealing; dielectric thin films; electron beam effects; fluorine; integrated circuit interconnections; ion beam effects; secondary ion mass spectroscopy; silicon compounds; 2000 angstrom; 410 degC; 6000 angstrom; IC interconnects; SIMS; SiN; SiON; backend annealing processes; cap oxides; electron beam irradiation; fluorinated-silicate-glass film stacks; interlayer dielectric; ion beam irradiation; liner oxide materials; out-diffusion; silicon rich oxide; Capacitance; Dielectric materials; Electron beams; Ion beams; Moisture; Plasma measurements; Production; Semiconductor films; Silicon; Simulated annealing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems, and Applications, 2001. Proceedings of Technical Papers. 2001 International Symposium on
Conference_Location :
Hsinchu
ISSN :
1524-766X
Print_ISBN :
0-7803-6412-0
Type :
conf
DOI :
10.1109/VTSA.2001.934533
Filename :
934533
Link To Document :
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