Title : 
Performance analysis of tapered gate in PD/SOI CMOS technology
         
        
            Author : 
Hwang, W. ; Chuang, C.T. ; Curran, B.W. ; Rosenfield, M.G.
         
        
            Author_Institution : 
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
         
        
        
        
        
        
            Abstract : 
“Tapered gate” is a device sizing methodology to improve the performance of critical paths in stacked circuit configurations. This paper presents a detailed study on the performance leverage of “taped gate” in a partially-depleted silicon-on-insulator (PD/SOI) technology. It is shown that because the reduced junction capacitance in the PD/SOI device renders the series resistance reduction of the lower transistors in the stack more effective, a “tapered gate” in PD/SOI technology has slightly larger improvement in the rising-input delays for the higher pins and slightly larger degradation on the lower pin falling-input delays compared with bulk CMOS technology. The effects are also shown to be more pronounced for low-VT cases. The study demonstrates that “tapered” gate remains a viable device sizing technique/methodology for performance improvement in a PD/SOI technology
         
        
            Keywords : 
CMOS integrated circuits; capacitance; integrated circuit layout; integrated circuit technology; silicon-on-insulator; PD/SOI CMOS technology; Si; critical paths; device sizing methodology; falling-input delays; junction capacitance; partially-depleted SOI technology; performance analysis; rising-input delays; series resistance reduction; stacked circuit configurations; tapered gate; Books; CMOS technology; Capacitance; Delay effects; Design methodology; Integrated circuit synthesis; Libraries; Performance analysis; Pins; Silicon on insulator technology;
         
        
        
        
            Conference_Titel : 
VLSI Technology, Systems, and Applications, 2001. Proceedings of Technical Papers. 2001 International Symposium on
         
        
            Conference_Location : 
Hsinchu
         
        
        
            Print_ISBN : 
0-7803-6412-0
         
        
        
            DOI : 
10.1109/VTSA.2001.934541