Title : 
Substrate and Ground Noise Interactions in Mixed-Signal Circuits
         
        
            Author : 
Salman, Emre ; Friedman, Eby G. ; Secareanu, Radu M.
         
        
            Author_Institution : 
Dept. of Electr. & Comput. Eng., Rochester Univ., Rochester, NY
         
        
        
        
        
        
            Abstract : 
The interaction of the substrate with the inductive on-chip ground distribution network is analyzed in this paper. A transistor level approach is presented to illustrate the effects of the substrate on ground noise. The substrate can have a significant effect on ground noise due to the inductance of the ground lines. For a CMOS inverter, the substrate can reduce negative peak ground noise by 49% during the high-to-low output transition. The substrate, however, increases the positive peak ground noise by 72% during the low-to-high output transition. The effect of the substrate should therefore not be neglected if the inductance of the on-chip ground distribution network is non-negligible. Furthermore, conventional triangle or trapezoid type current demand estimations of the nonlinear circuits are shown to be significantly inaccurate if the ground lines exhibit inductive behavior.
         
        
            Keywords : 
CMOS integrated circuits; integrated circuit modelling; integrated circuit noise; mixed analogue-digital integrated circuits; CMOS inverter; ground noise interaction; inductive on-chip ground distribution network; mixed-signal circuits; nonlinear circuits; Circuit noise; Inductance; Integrated circuit noise; Network-on-a-chip; Noise level; Noise reduction; Power system modeling; Power systems; Semiconductor device noise; Substrates;
         
        
        
        
            Conference_Titel : 
SOC Conference, 2006 IEEE International
         
        
            Conference_Location : 
Taipei
         
        
            Print_ISBN : 
0-7803-9781-9
         
        
            Electronic_ISBN : 
0-7803-9782-7
         
        
        
            DOI : 
10.1109/SOCC.2006.283901