• DocumentCode
    3255217
  • Title

    LeadFrameOnChip offers integrated power bus and bond over active circuit

  • Author

    Efland, T. ; Abbott, D. ; Arellano, V. ; Buschbom, M. ; Chang, W. ; Hoffart, C. ; Hutter, L. ; Mai, Q. ; Nishimura, I. ; Pendharkar, S. ; Pierce, M. ; Shen, C.C. ; Thee, C.M. ; Vanhorn, H. ; Williams, C.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    65
  • Lastpage
    68
  • Abstract
    A metal system consisting of thick electroplated copper leads having a top plating of nickel and palladium cap are integrated on top of power ICs to form a bondable LeadFrameOnChip surface
  • Keywords
    electroplated coatings; integrated circuit bonding; integrated circuit metallisation; integrated circuit packaging; power integrated circuits; Cu; LeadFrameOnChip; Ni; Pd; bond-over-active-circuit; electroplated copper lead; integrated power bus; nickel plating; palladium cap; power IC; surface metallization; Active circuits; Copper; Instruments; Nickel; Palladium; Power integrated circuits; Surface resistance; Switches; Voltage control; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs, 2001. ISPSD '01. Proceedings of the 13th International Symposium on
  • Conference_Location
    Osaka
  • ISSN
    1063-6854
  • Print_ISBN
    4-88686-056-7
  • Type

    conf

  • DOI
    10.1109/ISPSD.2001.934560
  • Filename
    934560
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3255217