Title :
Thermal analysis of hermetically sealed electromagnetic relay in high and low temperature condition
Author :
Wanbin, Ren ; Huimin, Liang ; Guofu, Zhai
Author_Institution :
Sch. of Electr. Eng. & Autom., Harbin Inst. of Technol., Harbin
Abstract :
Hermetically sealed structure is the optimal style to protect electromagnetic relay (EMR) from formidable working environment. Each product shall be subjected to thermal environment shock in accordance with MIL-STD-202 from -65degC to +125degC temperature, so it is of great importance for thermal analysis of EMR to increase the thermal stability and reliability requirement. In this paper, special finite element analysis (FEM) software ANSYS, was used for the accurate simulation of the internal relay structure. The elevated temperature characteristic of relay is investigated considering comprehensive thermal conductivity and convection effect. Internal complex heat transfer paths of EMR are determined and the influence of different temperature condition of inert gas on thermal performance is also researched. The results of the analysis can be useful for reliability thermal design of hermetically sealed EMR.
Keywords :
convection; electromagnetic devices; finite element analysis; hermetic seals; relays; reliability; thermal analysis; thermal conductivity; ANSYS software; convection effect; finite element analysis; hermetically sealed electromagnetic relay; internal complex heat transfer paths; internal relay structure simulation; reliability thermal design; temperature -65 degC to 125 degC; thermal analysis; thermal conductivity; Electric shock; Electromagnetic analysis; Electromagnetic radiation; Hermetic seals; Protection; Protective relaying; Relays; Stability analysis; Temperature; Thermal conductivity; finite element method (FEM); hermetically sealed electromagnetic relay; high and low temperature; thermal analysis;
Conference_Titel :
Electrical contacts - 2006, proceedings of the fifty-second ieee holm conference on
Conference_Location :
Montreal, QC
Print_ISBN :
1-4244-0581-5
DOI :
10.1109/HOLM.2006.284073
