DocumentCode
3255802
Title
Nanoscale Mechanical Properties of Intermetallics in Lead-Free Systems
Author
Braunovic, M. ; Gagnon, D. ; Rodrigue, L.
Author_Institution
MB Interface, Montreal, QC
fYear
2006
fDate
25-27 Sept. 2006
Firstpage
117
Lastpage
123
Abstract
Bimetallic couples formed between commercially available lead free alloys and selected contact materials were subjected to diffusion annealing using thermal gradients. Following diffusion annealing and ageing, the contact interfaces were subjected to a detailed metallographic, Scanning Electron Microscope (SEM), Energy Dispersive X-Ray (EDX) analyses. In addition, electrical resistance was used for electrical characterization of the intermetallics formed at the contact interfaces whereas nanoindentation technique was used to determine the nanoscale mechanical properties. An attempt was made to correlate the observed nanoindentation data with the microstructures of the intermetallic phases formed and electrical resistivity.
Keywords
X-ray chemical analysis; ageing; bimetals; conductors (electric); electrical resistivity; nanocontacts; scanning electron microscopy; solders; thermal analysis; ageing; bimetallic couples; contact interfaces; contact materials; diffusion annealing; electrical resistance; energy dispersive X-ray analyses; intermetallics; lead-free systems; metallographic; nanoindentation technique; nanoscale mechanical properties; scanning electron microscope; thermal gradients; Aging; Annealing; Contacts; Dispersion; Electric resistance; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Mechanical factors; Scanning electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical contacts - 2006, proceedings of the fifty-second ieee holm conference on
Conference_Location
Montreal, QC
Print_ISBN
1-4244-0581-5
Type
conf
DOI
10.1109/HOLM.2006.284074
Filename
4063110
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