DocumentCode :
3256316
Title :
Failure mechanisms of SOI high-voltage LIGBTs and LDMOSes under unclamped inductive switching
Author :
Garner, D.M. ; Udrea, E. ; Ensell, G. ; Sheng, K. ; Popescu, A.E. ; Amaratunga, G.A.J. ; Milne, W.I.
Author_Institution :
Dept. of Eng., Cambridge Univ., UK
fYear :
2001
fDate :
2001
Firstpage :
335
Lastpage :
338
Abstract :
This paper examines the behaviour of silicon-on-insulator (SOI) LIGBTs and LDMOSes under unclamped inductive switching (UIS). Surprisingly, it is found that LIGBTs can absorb much less UIS current than LDMOSes, specifically only between one-half and one-third. Two-dimensional device simulation showed that this was because hole injection from the LIGBT anode during turn-off changed the potential distribution within the device, leading to field concentration beneath the gate and hence premature failure of the gate. This has an important impact on the choice of a power device in a power integrated circuit, and its design
Keywords :
failure analysis; insulated gate bipolar transistors; power MOSFET; power semiconductor switches; silicon-on-insulator; LDMOS; LIGBT; SOI high-voltage transistor; failure mechanism; hole injection; potential distribution; power device; power integrated circuit; two-dimensional device simulation; unclamped inductive switching; Anodes; Breakdown voltage; Computational modeling; Computer science; Failure analysis; Integrated circuit manufacture; Magnetic switching; Power integrated circuits; Robustness; Silicon on insulator technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 2001. ISPSD '01. Proceedings of the 13th International Symposium on
Conference_Location :
Osaka
ISSN :
1063-6854
Print_ISBN :
4-88686-056-7
Type :
conf
DOI :
10.1109/ISPSD.2001.934623
Filename :
934623
Link To Document :
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