DocumentCode :
3256560
Title :
Breaking the silicon limit using semi-insulating Resurf layers
Author :
van Dalen, R. ; Rochefort, C. ; Hurkx, G.A.M.
Author_Institution :
Philips Res. Lab., Eindhoven, Netherlands
fYear :
2001
fDate :
2001
Firstpage :
391
Lastpage :
394
Abstract :
In this paper, we present results on a novel multi-Resurf technique that involves the use of semi-insulating layers, in which the flattening of the electric field profile is achieved by virtue of a small leakage current. Unlike conventional Resurf devices, this technique provides a perfect flattening of the field profile without the requirement of an accurate charge balance. Experimental results show an increase in steady-state breakdown voltage from 19 to 85 V for a device having 4 μm drift regions doped at 5e16 cm-3, with corresponding Ron below the silicon limit
Keywords :
leakage currents; power MOSFET; semiconductor device breakdown; 85 V; RESURF device; breakdown voltage; electric field; leakage current; on-resistance; power MOSFET; semi-insulating layer; silicon limit; Diodes; Electrical resistance measurement; Etching; Immune system; Leakage current; MOSFETs; Manufacturing processes; Medical simulation; Silicon; Steady-state;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 2001. ISPSD '01. Proceedings of the 13th International Symposium on
Conference_Location :
Osaka
ISSN :
1063-6854
Print_ISBN :
4-88686-056-7
Type :
conf
DOI :
10.1109/ISPSD.2001.934636
Filename :
934636
Link To Document :
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