• DocumentCode
    3256821
  • Title

    Infrared light induced degradation of polymeric materials used in optical devices

  • Author

    Osenbach, J.W. ; Jack, C.A. ; Singh, D. ; Srinivasan, G.V. ; Theis, C.D.

  • Author_Institution
    Agere Syst., Allentown, PA, USA
  • Volume
    1
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    789
  • Abstract
    This paper summarizes the current understanding of laser-induced damage in polymeric material systems. A detailed literature review including macroscopic and microscopic models for high optical intensity induced degradation and damage of polymeric systems is given. This is followed with experimental results and discussion on degradation of two different commonly used polymeric systems (acrylic and epoxy) due to exposure to medium optical intensity infrared light. We show that in acrylic systems, degradation occurs slowly over time at infrared wavelengths as high as 1480 nm and optical power densities as low as 5×104 W/cm2 via a multi-photon absorption process. We show that in bisphenol based epoxy systems (bisphenol based epoxies are widely used as structural adhesives in many optical devices), degradation also occurs via a multi-photon absorption process. The degradation process in both cases is very sensitive to both wavelength and optical power density. Finally, we give preliminary design guidelines for the use of bisphenol-based epoxies in high optical power density applications.
  • Keywords
    adhesives; laser beam effects; light absorption; optical polymers; 1480 nm; acrylic systems; bisphenol based epoxy; high optical intensity induced degradation; infrared light induced degradation; laser-induced damage; macroscopic models; microscopic models; multiphoton absorption process; optical devices; optical power density; polymeric materials; structural adhesives; Electromagnetic wave absorption; Guidelines; Laser modes; Optical design; Optical devices; Optical materials; Optical microscopy; Optical polymers; Optical sensors; Thermal degradation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2004. Proceedings. 54th
  • Print_ISBN
    0-7803-8365-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2004.1319427
  • Filename
    1319427