DocumentCode :
3257064
Title :
IPDA: interconnect performance design assistant
Author :
Change, N.H. ; Chang, Norman H. ; Leo, John ; Lee, Ken ; Oh, Soo-Young
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
fYear :
1992
fDate :
8-12 Jun 1992
Firstpage :
472
Lastpage :
477
Abstract :
IPDA is a generic interconnect performance design assistant that integrates a finite-difference numerical simulation method, linear interpolation algorithm, interactive performance synthesis methodology, and lossless/lossy transmission-line SPICE modeling capability into a spreadsheet-style graphical user interface. The algorithm, implementation, and methodology of IPDA are described and an application example is discussed. Although the authors describe electrical performance measures for given geometry and material parameters of conductors and dielectrics, IPDA can be customized for other packaging measures such as reliability and thermal and cost effects through spreadsheet interface and calculations. IPDA assists users in selecting interconnect technologies for design-for-performance goals and also in optimizing interconnect performance designs for the full hierarchy of packaging including IC/multichip module/printed circuit board/lead-bonding/via interconnect designs
Keywords :
circuit analysis computing; finite difference methods; graphical user interfaces; interpolation; IPDA; electrical performance measures; finite-difference numerical simulation; interactive performance synthesis methodology; interconnect performance design assistant; linear interpolation algorithm; lossless/lossy transmission-line SPICE modeling; spreadsheet-style graphical user interface; Algorithm design and analysis; Conducting materials; Dielectric measurements; Electric variables measurement; Finite difference methods; Integrated circuit interconnections; Numerical simulation; Packaging; Performance loss; Propagation losses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 1992. Proceedings., 29th ACM/IEEE
Conference_Location :
Anaheim, CA
ISSN :
0738-100X
Print_ISBN :
0-8186-2822-7
Type :
conf
DOI :
10.1109/DAC.1992.227757
Filename :
227757
Link To Document :
بازگشت