• DocumentCode
    3257252
  • Title

    Electrification and space charge under electric stress in high temperature on epoxy resin

  • Author

    Fukuma, M. ; Ishiduki, K. ; Kotake, S.

  • Author_Institution
    Dept. of Electr. Eng., Matsue Coll. of Technol., Matsue
  • fYear
    2008
  • fDate
    7-11 Sept. 2008
  • Firstpage
    52
  • Lastpage
    55
  • Abstract
    The semiconductor devices which used the electric field effect have the possibility to cause the malfunction due to the electrification. There is a case in which the anti-static additives (ASA) are used in order to avoid malfunction due to the electrification of the epoxy resin. In this report, the electrification phenomena under electric field stress in a high temperature (3-6 kV/mm, 100-155degC) in epoxy resin have been observed on the effect of ASA by using one-and two- dimensional space charge distribution measurement system. From the results of space charge measurement, it was found that the epoxy resin with ASA have made the following effect to the space charge formation by the high-temperature(100,155degC) and electric field charging (10 kV/1.5 mm, 6 kV/1.5 mm). It is considered that the ASA reduce the hetero electric field near the electrode interface; the appropriate quantity addition of the ASA to the epoxy resin is effective for relaxation of the electrification of the epoxy resin in the high temperature.
  • Keywords
    organic insulating materials; polymers; space charge; static electrification; stress effects; electric field stress; electrification; epoxy resin; high temperature; space charge; temperature 100 degC to 155 degC; Charge measurement; Current measurement; Electric variables measurement; Electrodes; Epoxy resins; Semiconductor devices; Semiconductor materials; Space charge; Stress; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
  • Conference_Location
    Mie
  • Print_ISBN
    978-4-88686-005-7
  • Electronic_ISBN
    978-4-88686-006-4
  • Type

    conf

  • DOI
    10.1109/ISEIM.2008.4664441
  • Filename
    4664441