• DocumentCode
    3257409
  • Title

    Effect study of bridge voltage on measurement of thermal conductivities of liquids by thermal probe method

  • Author

    Zhang, Min ; Lu, Jiahua ; Chen, Jianhua ; Che, Zhenhua ; Le Yang ; Zhong, Zhiyou ; Zhao, Huizhong

  • Author_Institution
    Coll. of Food Sci. & Technol., Shanghai Ocean Univ., Shanghai, China
  • Volume
    9
  • fYear
    2010
  • fDate
    16-18 Oct. 2010
  • Firstpage
    4217
  • Lastpage
    4220
  • Abstract
    The thermal probe method can be conveniently and rapidly used to measure the thermal conductivities of liquids. But the bridge voltages chosen differently would have large effect on output electric voltage signal ΔV which would directly influence the results of experiments. To obtain the best value of voltage, the effects of different bridge voltages on thermal conductivities of samples were studied by experiments and theoretical analysis of heat transfer and numerical simulation. The results showed that the deviation of thermal conductivities were below 2 % when the bridge voltage was at 2.0V~8.0V. The number of GrPr was 1×103~0.98×104 which was less than 1×104. Each measurement was completed within one minute and the temperature rise was less than under 1 °C. It can effectively reduce the effect of convection and radiation to obtain accurately the thermal conductivity of liquid.
  • Keywords
    bridge instruments; thermal conductivity; thermal variables measurement; bridge voltage; convection; heat transfer; liquid thermal conductivity measurement; numerical simulation; radiation; thermal probe method; voltage 2.0 V to 8.0 V; Bridge circuits; Conductivity; Conductivity measurement; Probes; Temperature measurement; Thermal conductivity; Voltage measurement; bridge voltage; liquid; output electric voltage signal; thermal conductivity; thermal probe;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Image and Signal Processing (CISP), 2010 3rd International Congress on
  • Conference_Location
    Yantai
  • Print_ISBN
    978-1-4244-6513-2
  • Type

    conf

  • DOI
    10.1109/CISP.2010.5646821
  • Filename
    5646821