Title :
Detection of ion migration in composites for printed circuit boards by the pulsed electroacoustic method
Author :
Natsui, M. ; Echigo, Y. ; Tanaka, T. ; Ohki, Y. ; Maeno, T.
Author_Institution :
Dept. of Electr. Eng. & Biosci., Waseda Univ., Tokyo
Abstract :
Pulsed electroacoustic (PEA) method is applied as a nondestructive technique to detect ion migration that progresses to the thickness direction in insulation composites for printed circuit boards. In both cases of a paper/phenol-resin composite and a glass/epoxy-resin composite, penetration of Cu migration into the bulk after aging was confirmed. Namely, a shift of the peak location of positive charge, which corresponds to the progress of migration in the aged composite, is observable by the PEA method.
Keywords :
composite insulators; nondestructive testing; printed circuits; pulsed electroacoustic methods; insulation composites; ion migration; nondestructive technique; printed circuit boards; pulsed electroacoustic method; Aging; Composite materials; Conducting materials; Copper; Degradation; Dielectrics and electrical insulation; Glass; Printed circuits; Pulsed electroacoustic methods; Surface resistance;
Conference_Titel :
Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
Conference_Location :
Mie
Print_ISBN :
978-4-88686-005-7
Electronic_ISBN :
978-4-88686-006-4
DOI :
10.1109/ISEIM.2008.4664459
