Title :
Free drop test simulation for portable IC package by implicit transient dynamics FEM
Author :
Irving, Scott ; Liu, Yong
Author_Institution :
Fairchild Semicond. Corp., South Portland, ME, USA
Abstract :
Free drop test performance of portable IC packages is a key reliability criteria for handheld products. Various experimental test methods are widely applied to measure the drop test response and to test for visual and electrical failures after the drop test. However, the experimental data we can collect is very limited, especially for the impact of stress wave propagation and distribution to the component and device. For understanding the physical transient dynamic failure problem, modeling is an effective method that provides details of the dynamic stress wave and the response at any time, any cross-section or position.
Keywords :
dynamic response; finite element analysis; impact (mechanical); integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; drop test response modeling; dynamic stress wave; electrical failures; free drop test simulation; handheld product reliability; implicit transient dynamics FEM; physical transient dynamic failure; portable IC package; stress wave distribution; stress wave propagation; visual failures; Aerodynamics; Integrated circuit modeling; Integrated circuit packaging; Integrated circuit testing; Materials testing; Postal services; Semiconductor device packaging; Semiconductor device testing; Stress; Vehicle dynamics;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1319471
