Free drop test simulation for portable IC package by implicit transient dynamics FEM

Author

Irving, Scott ; Liu, Yong

Author_Institution

Fairchild Semicond. Corp., South Portland, ME, USA

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

1062

Abstract

Free drop test performance of portable IC packages is a key reliability criteria for handheld products. Various experimental test methods are widely applied to measure the drop test response and to test for visual and electrical failures after the drop test. However, the experimental data we can collect is very limited, especially for the impact of stress wave propagation and distribution to the component and device. For understanding the physical transient dynamic failure problem, modeling is an effective method that provides details of the dynamic stress wave and the response at any time, any cross-section or position.

Keywords

dynamic response; finite element analysis; impact (mechanical); integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; drop test response modeling; dynamic stress wave; electrical failures; free drop test simulation; handheld product reliability; implicit transient dynamics FEM; physical transient dynamic failure; portable IC package; stress wave distribution; stress wave propagation; visual failures; Aerodynamics; Integrated circuit modeling; Integrated circuit packaging; Integrated circuit testing; Materials testing; Postal services; Semiconductor device packaging; Semiconductor device testing; Stress; Vehicle dynamics;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319471

Filename

1319471