• DocumentCode
    3258146
  • Title

    Co-Cu granular alloys prepared by electrodeposition

  • Author

    Aitelhadjali, Z. ; Benbrahim, N. ; Kadri, A. ; Dahmane, Y. ; Benfedda, B. ; Voiron, J. ; Lienard, A.

  • Author_Institution
    Lab. de Materiaux Electrochimie et Corrosion, Mouloud Mammeri Univ., Tizi-Ouzou, Algeria
  • fYear
    2004
  • fDate
    6-8 Dec. 2004
  • Firstpage
    668
  • Lastpage
    671
  • Abstract
    Preparation of granular Cu-Co films produced by electrodeposition, from a single sulfate bath containing both cobalt ions and low concentration of copper has been investigated. Combining in-situ electrochemical and microgravimetric measurements, the kinetics of cobalt and copper reduction are presented. The thickness and deposition rates are monitored using an electrochemical quartz crystal microbalance (EQCM) during the growth of films of heterogeneous Co-Cu alloys. Structural characterization was performed by X-ray diffraction. Magnetic measurements have shown a superparamagnetic behavior, in agreement with the existence of very small cobalt particles imbedded in the copper matrix.
  • Keywords
    X-ray diffraction; cobalt alloys; copper alloys; discontinuous metallic thin films; electrochemistry; electrodeposition; ferromagnetic materials; giant magnetoresistance; granular materials; ion density; magnetic moments; magnetic thin films; microbalances; superparamagnetism; zero gravity experiments; CuCo; X-ray diffraction; cobalt ions; copper concentration; copper matrix; discontinuous metallic thin films; electrochemical quartz crystal microbalance; electrodeposition; ferromagnetic materials; giant magnetoresistance; granular CuCo film preparation; heterogeneous CoCu granular alloys; in situ electrochemical measurement; in situ microgravimetric measurement; magnetic measurement; single sulfate bath; structural properties; superparamagnetism; zero gravity experiments; Copper; Electrodes; Giant magnetoresistance; Iron alloys; Magnetic films; Magnetic materials; Magnetic multilayers; Magnetic properties; Sputtering; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2004. ICM 2004 Proceedings. The 16th International Conference on
  • Print_ISBN
    0-7803-8656-6
  • Type

    conf

  • DOI
    10.1109/ICM.2004.1434754
  • Filename
    1434754