• DocumentCode
    3258239
  • Title

    Superior thermal breakdown performance of MgO-LDPE nanocomposite materials for HVDC insulation

  • Author

    Reddy, Ch Chakradhar ; Gosyowaki, Manabu ; Murata, Yoshinao ; Sekiguchi, Yoitsu

  • Author_Institution
    R&D Center, J-Power Syst. Corp. Ltd., Hitachi
  • fYear
    2008
  • fDate
    7-11 Sept. 2008
  • Firstpage
    661
  • Lastpage
    664
  • Abstract
    In spite of the bourgeoning evidence of improvements in material properties, the mechanism of conduction and breakdown in nanocomposite dielectrics is not yet clear. Understanding the macroscopic properties of nanocomposites is essential for the use and application of the nanodielectrics as also to pave the way for providing an understanding at nano-scale. Any hypothesis explaining the nano-scale effects must explain the changes in macroscopic material properties. With this objective in view, the authors investigated the dc conduction and breakdown in nanocomposites. Experimental results and a rigorous analysis of the volume resistivity data presented in the paper provides a more clear evidence of the effect of variation in the material properties on insulation breakdown.
  • Keywords
    composite insulating materials; electric breakdown; electrical conductivity; electrical resistivity; filled polymers; magnesium compounds; nanocomposites; polyethylene insulation; thermal conductivity; HVDC insulation; MgO; dc conduction; insulation breakdown; nanocomposite breakdown; nanocomposite material; volume resistivity; Conducting materials; Conductivity measurement; Electric breakdown; HVDC transmission; Insulation; Material properties; Nanostructured materials; Temperature; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
  • Conference_Location
    Mie
  • Print_ISBN
    978-4-88686-005-7
  • Electronic_ISBN
    978-4-88686-006-4
  • Type

    conf

  • DOI
    10.1109/ISEIM.2008.4664494
  • Filename
    4664494