Title :
Copper Interconnect: Fabrication And Reliability
Author :
Hu, C.-K. ; Harper, J.M.E.
Keywords :
Conductivity; Copper; Electromigration; Fabrication; Impurities; Integrated circuit interconnections; Particle scattering; Surface resistance; Temperature; Wiring;
Conference_Titel :
VLSI Technology, Systems, and Applications, 1997. Proceedings of Technical Papers. 1997 International Symposium on
Conference_Location :
Taipei, Taiwan
Print_ISBN :
0-7803-4131-7
DOI :
10.1109/VTSA.1997.614718
