• DocumentCode
    3258721
  • Title

    Incorporating local variables in mixed-signal assertions

  • Author

    Mukherjee, Subhankar ; Dasgupta, Pallab

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Indian Inst. of Technol. Kharagpur, Kharagpur, India
  • fYear
    2009
  • fDate
    23-26 Jan. 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In verification of Analog and Mixed-Signal (AMS) designs, considerable efforts are being given now days towards extending assertion languages such as Property Specification Language (PSL) and SystemVerilog Assertions (SVA) to capture mixed-signal behaviors and verify them on mixed-signal design at run-time. In SVA and PSL the temporal properties are written on boolean valued signals only, whereas in the AMS extensions we intend to handle the real valued variables (like voltages, currents etc) by encapsulating them in terms of analog predicates. In this paper we discuss how certain complex mixed-signal properties can be encoded with the help of local variables and describe a methodology for dynamically verifying such AMS properties by mapping them into SVA properties. We demonstrate the proof of concept using our prototype toolkit which parses the AMS properties involving local variables and generates corresponding equivalent SVA properties and Verilog-AMS monitors to verify them dynamically using Synopsys´ mixed-signal simulator Nanosim-VCS along with SVA checker.
  • Keywords
    formal verification; hardware description languages; integrated circuit design; mixed analogue-digital integrated circuits; Nanosim-VCS mixed-signal simulator; SystemVerilog assertions; Verilog-AMS monitors; local variables; mixed-signal design; property specification language; Computer science; Control systems; Design engineering; Digital control; Hardware design languages; Runtime; Signal design; Specification languages; Virtual prototyping; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2009 - 2009 IEEE Region 10 Conference
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-4546-2
  • Electronic_ISBN
    978-1-4244-4547-9
  • Type

    conf

  • DOI
    10.1109/TENCON.2009.5396176
  • Filename
    5396176