Title :
Challenges for IC failure analysis-present and future
Author :
Anderson, Richard E. ; Soden, Jerry M. ; Henderson, Christopher L. ; Cole, Edward I., Jr.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
fDate :
27 Nov-1 Dec 1995
Abstract :
Failure analysis is a critical element in integrated circuit manufacturing. This paper explores the challenges for IC failure analysis in the environment of present and future silicon IC technology trends, using the 1994 National Technology Roadmap for Semiconductors as a technology guide. Advanced techniques that meet the challenges of state-of-the-art IC technology are described and their applications are discussed. New approaches shall be required for failure analysis to keep pace with future advancements in IC technology
Keywords :
failure analysis; integrated circuit testing; technological forecasting; IC failure analysis; NTRS; Si; integrated circuit manufacturing; silicon IC technology; Circuit testing; Failure analysis; Flip chip; Integrated circuit packaging; Integrated circuit technology; Integrated circuit testing; Optical microscopy; Power distribution; Voltage; Wiring;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 1995., Proceedings of the 1995 5th International Symposium on the
Print_ISBN :
0-7803-2797-7
DOI :
10.1109/IPFA.1995.487587
