DocumentCode
3259291
Title
Nano- and micro-filler combination enabling practical use of nanocomposite insulating materials
Author
Imai, Takahiro ; Komiya, Gen ; Murayama, Kiyoko ; Ozaki, Tamon ; Sawa, Fumio ; Shimizu, Toshio ; Harada, Miyuki ; Ochi, Mitsukazu ; Ohki, Yoshimichi ; Tanaka, Toshikatsu
Author_Institution
Power & Ind. Syst. R&D Center, Toshiba Corp., Fuchu
fYear
2008
fDate
7-11 Sept. 2008
Firstpage
299
Lastpage
302
Abstract
Recent interests concerning nanocomposites are shifting emphasis from fundamental research to application-oriented research. In this study, nano- and micro-filler mixed composites were made and evaluated toward practical use of nanocomposite insulating materials. Some kinds of the nano-filler/micro-filler combinations such as nano-layered silicate/micro-silica, nano-silica/micro-silica and nano-titania/micro-silica were compared from viewpoints of volume resistivitiy, relative permittivity, thermal expansion and insulation breakdown properties. Comprehensive consideration based on experimental results determined a candidate nano- and micro-filler mixed composites to make trial models. An aluminum conductor and a vacuum interrupter were molded from the nano- and micro-filler mixed composites for the first time in nanocomposite research.
Keywords
electric breakdown; epoxy insulation; epoxy insulators; filled polymers; insulating materials; nanocomposites; permittivity; thermal expansion; SiO2; aluminum conductor; insulation breakdown property; mixed composites; nanocomposite insulating materials; nanofiller- microfiller combination; nanolayered materials; nanosilica-micro-silica; nanotitania-micro-silica; relative permittivity; silicate-microsilica; thermal expansion; vacuum interrupter; volume resistivitiy; Aluminum; Composite materials; Conductors; Electric breakdown; Insulation; Interrupters; Nanostructured materials; Permittivity; Thermal expansion; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
Conference_Location
Mie
Print_ISBN
978-4-88686-005-7
Electronic_ISBN
978-4-88686-006-4
Type
conf
DOI
10.1109/ISEIM.2008.4664556
Filename
4664556
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