• DocumentCode
    3259291
  • Title

    Nano- and micro-filler combination enabling practical use of nanocomposite insulating materials

  • Author

    Imai, Takahiro ; Komiya, Gen ; Murayama, Kiyoko ; Ozaki, Tamon ; Sawa, Fumio ; Shimizu, Toshio ; Harada, Miyuki ; Ochi, Mitsukazu ; Ohki, Yoshimichi ; Tanaka, Toshikatsu

  • Author_Institution
    Power & Ind. Syst. R&D Center, Toshiba Corp., Fuchu
  • fYear
    2008
  • fDate
    7-11 Sept. 2008
  • Firstpage
    299
  • Lastpage
    302
  • Abstract
    Recent interests concerning nanocomposites are shifting emphasis from fundamental research to application-oriented research. In this study, nano- and micro-filler mixed composites were made and evaluated toward practical use of nanocomposite insulating materials. Some kinds of the nano-filler/micro-filler combinations such as nano-layered silicate/micro-silica, nano-silica/micro-silica and nano-titania/micro-silica were compared from viewpoints of volume resistivitiy, relative permittivity, thermal expansion and insulation breakdown properties. Comprehensive consideration based on experimental results determined a candidate nano- and micro-filler mixed composites to make trial models. An aluminum conductor and a vacuum interrupter were molded from the nano- and micro-filler mixed composites for the first time in nanocomposite research.
  • Keywords
    electric breakdown; epoxy insulation; epoxy insulators; filled polymers; insulating materials; nanocomposites; permittivity; thermal expansion; SiO2; aluminum conductor; insulation breakdown property; mixed composites; nanocomposite insulating materials; nanofiller- microfiller combination; nanolayered materials; nanosilica-micro-silica; nanotitania-micro-silica; relative permittivity; silicate-microsilica; thermal expansion; vacuum interrupter; volume resistivitiy; Aluminum; Composite materials; Conductors; Electric breakdown; Insulation; Interrupters; Nanostructured materials; Permittivity; Thermal expansion; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 2008. (ISEIM 2008). International Symposium on
  • Conference_Location
    Mie
  • Print_ISBN
    978-4-88686-005-7
  • Electronic_ISBN
    978-4-88686-006-4
  • Type

    conf

  • DOI
    10.1109/ISEIM.2008.4664556
  • Filename
    4664556