DocumentCode
325954
Title
Determining the equivalent impedance boundary condition for material-coated corrugated gratings based on the genetic algorithm
Author
Su, T. ; Ling, H.
Author_Institution
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Volume
1
fYear
1998
fDate
21-26 June 1998
Firstpage
38
Abstract
An impedance boundary condition model based on the genetic algorithm is proposed to approximate arbitrary coated gratings in scattering problems. The periodic structure is replaced by a periodic impedance boundary condition (IBC) on a virtual surface. The boundary impedance and the position of the surface are optimized by matching the reflection coefficients to the rigorous numerical solution at a number of incident angles. Similar to traditional IBC models, this approach is most effective when the coating material is high-loss and of high contrast. Finally, the output IBC model generated by this algorithm can be incorporated into an existing computational electromagnetics code to assess the performance of the corrugated surface when mounted on complex platforms.
Keywords
approximation theory; boundary-value problems; diffraction gratings; electric impedance; electromagnetic wave diffraction; electromagnetic wave reflection; electromagnetic wave scattering; genetic algorithms; method of moments; periodic structures; IBC approximation; coating material; complex platforms; computational electromagnetics code; corrugated surface performance; genetic algorithm; high contrast; high-loss; impedance boundary condition model; incident angles; material-coated corrugated gratings; method of moments; output IBC model; periodic impedance boundary condition; reflection coefficients; scattering problems; virtual surface; Boundary conditions; Coatings; Computational electromagnetics; Electromagnetic modeling; Electromagnetic reflection; Electromagnetic scattering; Genetic algorithms; Gratings; Periodic structures; Surface impedance;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 1998. IEEE
Conference_Location
Atlanta, GA, USA
Print_ISBN
0-7803-4478-2
Type
conf
DOI
10.1109/APS.1998.698752
Filename
698752
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