• DocumentCode
    3259577
  • Title

    Challenges And Issues Of Low-k Dielectrics

  • Author

    Chiang, Chien ; Mack, Anne S. ; Pan, Chuanbin ; Fraser, David B.

  • fYear
    1997
  • fDate
    3-5 June 1997
  • Firstpage
    37
  • Lastpage
    39
  • Keywords
    Dielectric constant; Dielectric materials; Integrated circuit interconnections; Polymer films; Power system interconnection; Silicon compounds; Stability; Temperature; Thermal expansion; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems, and Applications, 1997. Proceedings of Technical Papers. 1997 International Symposium on
  • Conference_Location
    Taipei, Taiwan
  • ISSN
    1524-766X
  • Print_ISBN
    0-7803-4131-7
  • Type

    conf

  • DOI
    10.1109/VTSA.1997.614722
  • Filename
    614722
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3259577