3259577

Challenges And Issues Of Low-k Dielectrics

Chiang, Chien ; Mack, Anne S. ; Pan, Chuanbin ; Fraser, David B.

1997

3-5 June 1997

37

39

Dielectric constant; Dielectric materials; Integrated circuit interconnections; Polymer films; Power system interconnection; Silicon compounds; Stability; Temperature; Thermal expansion; Thermal stresses;

English

ieee

VLSI Technology, Systems, and Applications, 1997. Proceedings of Technical Papers. 1997 International Symposium on

Taipei, Taiwan

1524-766X

0-7803-4131-7

conf

10.1109/VTSA.1997.614722

614722