DocumentCode
3259749
Title
Future datacenter interfaces based on existing and emerging optics technologies
Author
Cole, Chris
Author_Institution
Finisar Corp., Sunnyvale, CA, USA
fYear
2013
fDate
8-10 July 2013
Firstpage
217
Lastpage
218
Abstract
Mainstream datacenter interfaces use NRZ modulation, VCSEL or DFB lasers, parallel or WDM channels, packaged in pluggable modules. Emerging technologies are higher order modulation, faster lane rate, InP or Si modulator (Si Mod), and board mounted optics. Future datacenter interfaces will use all of these to increase link rates.
Keywords
III-V semiconductors; computer centres; computer interfaces; distributed feedback lasers; indium compounds; modules; optical communication equipment; optical modulation; packaging; silicon; surface emitting lasers; DFB lasers; InP; NRZ modulation; VCSEL; WDM channels; datacenter interfaces; parallel channels; pluggable modules; Modulation; Optical fibers; Optical signal processing; Optical switches; Vertical cavity surface emitting lasers; 1.6TbE; 100Gb; 400GbE; CAUI-4; CDAUI-4; CDAUI-8; DFB laser; HOM; NRZ; OE; Si Mod; VCSEL; WDM;
fLanguage
English
Publisher
ieee
Conference_Titel
Photonics Society Summer Topical Meeting Series, 2013 IEEE
Conference_Location
Waikoloa, HI
Print_ISBN
978-1-4673-5059-4
Type
conf
DOI
10.1109/PHOSST.2013.6614473
Filename
6614473
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