Title :
Future datacenter interfaces based on existing and emerging optics technologies
Author_Institution :
Finisar Corp., Sunnyvale, CA, USA
Abstract :
Mainstream datacenter interfaces use NRZ modulation, VCSEL or DFB lasers, parallel or WDM channels, packaged in pluggable modules. Emerging technologies are higher order modulation, faster lane rate, InP or Si modulator (Si Mod), and board mounted optics. Future datacenter interfaces will use all of these to increase link rates.
Keywords :
III-V semiconductors; computer centres; computer interfaces; distributed feedback lasers; indium compounds; modules; optical communication equipment; optical modulation; packaging; silicon; surface emitting lasers; DFB lasers; InP; NRZ modulation; VCSEL; WDM channels; datacenter interfaces; parallel channels; pluggable modules; Modulation; Optical fibers; Optical signal processing; Optical switches; Vertical cavity surface emitting lasers; 1.6TbE; 100Gb; 400GbE; CAUI-4; CDAUI-4; CDAUI-8; DFB laser; HOM; NRZ; OE; Si Mod; VCSEL; WDM;
Conference_Titel :
Photonics Society Summer Topical Meeting Series, 2013 IEEE
Conference_Location :
Waikoloa, HI
Print_ISBN :
978-1-4673-5059-4
DOI :
10.1109/PHOSST.2013.6614473
