Title : 
Modeling and analysis of factors of size effect in micro-cutting: The tool geometry and the depth of cutting
         
        
            Author : 
Jing, X.B. ; Lin, Bo ; Zhang, David Wei
         
        
            Author_Institution : 
Sch. of Mech. Eng., Tianjin Univ., Tianjin, China
         
        
        
        
        
        
            Abstract : 
Based on the finite element approach and the strain gradient (SG) theory, this paper produced a study on factors of size effect and minimum cutting thickness phenomenon in the micro-cutting process. Mechanisms of micro-cutting focusing on its characteristics that include size effect, tool edge radius and minimum cutting thickness has been studied. A new constitutive relationship based on SG theory is formulated to model the size effect of material properties at micro-scale. The new constitutive was implanted into the FEM, and size effect was investigated. From the result of simulation, it is indicated that size effect in micro-cutting could be well formulated by SG theory. The curve of material properties is approached to curve of JC with the depth cutting increased; when the rake angle is increased, the size effect is more obvious. The tool edge radius has a significant influence on the size effect. Result show that the cause of the minimum chip thickness is the tool edge radius.
         
        
            Keywords : 
cutting; cutting tools; finite element analysis; micromachining; FEM; SG theory; cutting depth; cutting thickness; cutting tool edge radius; cutting tool geometry; finite element method; microcutting; size effect; strain gradient theory; Equations; Finite element analysis; Manufacturing; Materials; Mathematical model; Strain; Stress; Minimum chip thickness; constitutive relationship; micro-cutting; size effect;
         
        
        
        
            Conference_Titel : 
Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 2013 International Conference on
         
        
            Conference_Location : 
Suzhou
         
        
            Print_ISBN : 
978-1-4799-1210-0
         
        
        
            DOI : 
10.1109/3M-NANO.2013.6737440