• DocumentCode
    3260311
  • Title

    Realization of high aspect ratio silicon microneedles using optimized process for bio medical applications

  • Author

    Islam, Shofiqul ; Abser, Nurul ; Islam, Nurul ; Shivan, Tanjil

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Bangladesh Univ. of Eng. & Technol., Dhaka, Bangladesh
  • fYear
    2009
  • fDate
    23-26 Jan. 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Silicon microneedles were fabricated extensively for bio-medical applications by using optimized process. The entire process was simulated and resultant micro structures have been analyzed and reported. Microneedle fabrication was carried out in three different etch techniques and the outputs were compared. The optimized structure was obtained by manipulating etch parameters, mask size and isotropy coefficient of etchants. The aspect ratio (AR) of the fabricated microneedles was found to be much higher than that of any other hollow microneedles reported previously. Mechanical strength and fluid flow characteristics were also calculated and the data obtained from the calculations indicated that the structures should be compatible with modern biomedical applications such as drug and gene delivery, protein and DNA injection etc.
  • Keywords
    bioMEMS; masks; mechanical strength; medical supplies; microfabrication; needles; silicon; sputter etching; DNA injection; Si; aspect ratio; drug delivery; etching; gene delivery; isotropy coefficient; mask size; mechanical strength; protein injection; silicon microneedles; Analytical models; Biomedical equipment; Drugs; Etching; Fabrication; Fluid flow; Medical services; Medical simulation; Proteins; Silicon; Microneedle; RIE; biomedical applications; high aspect ratio; plasma etch; wet etch;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2009 - 2009 IEEE Region 10 Conference
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-4546-2
  • Electronic_ISBN
    978-1-4244-4547-9
  • Type

    conf

  • DOI
    10.1109/TENCON.2009.5396246
  • Filename
    5396246