Title :
Packaging of VLSI devices
Author_Institution :
Tech. Univ. Berlin, West Germany
Abstract :
VLSI technologies are characterized by a drastic reduction of component size and the economical production of large-area chips. Electrical and geometrical characteristics of modern VLSI chips require a synchronized progress in the development of chip and board technologies. Furthermore, alternative hierarchies within electronic systems, such as the application of multichip modules or microsystems, must be considered. The geometrical and electrical chip parameters are discussed, and the requirements for future packaging technologies are summarized
Keywords :
VLSI; packaging; VLSI devices; component size; electrical characteristics; electronic systems; geometrical characteristics; microsystems; multichip modules; Bonding; Cost function; Electronics packaging; Geometry; Integrated circuit packaging; Niobium; Pins; Printed circuits; Silicon; Very large scale integration;
Conference_Titel :
CompEuro '89., 'VLSI and Computer Peripherals. VLSI and Microelectronic Applications in Intelligent Peripherals and their Interconnection Networks', Proceedings.
Conference_Location :
Hamburg
Print_ISBN :
0-8186-1940-6
DOI :
10.1109/CMPEUR.1989.93485
