A multilayered packaging architecture for spatial power combined arrays

The explosion of interest in high data rate communications places great demands on antenna designs. Antennas used for transmitting signals can require high gain with high radiated power. An efficient means to accomplish these goals is the free space combining of many amplifiers via elements in an antenna array. Combining the output power of the MMIC amplifiers in space obviates the circuit losses associated with connecting many amplifiers in parallel and results in potentially more efficient transmitting antennas. However, the implementation of arrays with many MMIC amplifiers and antenna elements requires a compact, multilayered packaging architecture to achieve the density of circuits with desired performance. This problem is discussed.