DocumentCode :
3261588
Title :
Development of the high voltage e-beam lithography system
Author :
Ren, Zheng ; Li, Qunqing ; Han, Li
Author_Institution :
Tsinghua-Foxconn Nanotechnology Research Center, Department of Physics, Tsinghua University, Beijing, P.R. China 100084
fYear :
2007
fDate :
3-4 June 2007
Firstpage :
114
Lastpage :
116
Abstract :
High voltage electron beam lithography has a number of advantages over conventional 50kV-voltage e-beam lithography systems, such as reducing proximity effect, reducing line-width variation, and obtaining high aspect ratios of line height to gap width. The new high voltage e-beam lithography system is based on a JEOL JEM2000EX Transmission Electron Microscope (TEM) with scanning system. As the sample is immersed in the high intensity magnetic field during the exposure process, the movement of electrons in the resist and substrate is limited in a smaller area. By using this system to carry out some exposure experiments, we have obtained the structure with 10:1 high-width aspect ratio on a 3-micron-thick PMMA layer with a large area.
Keywords :
Acceleration; Etching; Fabrication; Lenses; Lithography; Micromechanical devices; Proximity effect; Resists; Transmission electron microscopy; Voltage; High Voltage E-beam Lithography; PMMA; Thick Resist; Transmission Electron Microscope;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Semiconductor Technology, 2007. EDST 2007. Proceeding of 2007 International Workshop on
Conference_Location :
Tsinghua University
Print_ISBN :
1-4244-1098-3
Electronic_ISBN :
1-4244-1098-3
Type :
conf
DOI :
10.1109/EDST.2007.4289791
Filename :
4289791
Link To Document :
بازگشت