Title :
Silicon complexity required for VCSEL based smart pixels
Author_Institution :
Irvine Sensors Corp., Costa Mesa, CA, USA
Abstract :
The silicon complexity of VCSEL based smart pixels is analysed. It is shown that the combination of 3D chip stacks and optical interconnects will enable application of such systems where interconnection bandwidth and processing throughput can be balanced and can reach Terabits range
Keywords :
optical interconnections; smart pixels; surface emitting lasers; 3D chip stack; VCSEL; optical interconnect; silicon complexity; smart pixels; Bandwidth; Optical interconnections; Optical receivers; Optical sensors; Optical transmitters; Packaging; Silicon; Smart pixels; Throughput; Vertical cavity surface emitting lasers;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS '97 10th Annual Meeting. Conference Proceedings., IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3895-2
DOI :
10.1109/LEOS.1997.645153
