Title :
On Through Silicon Vias as used in three dimensional integrated circuits
Author :
Minvielle, Robert ; Bayoumi, M.
Abstract :
This paper presents a survey of 3D Integrated Circuits using Through Silicon Vias (TSV). 3D Integrated Circuits and the TSV will be defined, the rationale for moving to these systems will be given, and an overview of the construction of the 3D Integrated Circuit and TSV will be presented. Lastly, the challenges for 3D Integrated Circuits using TSVs will be discussed.
Keywords :
three-dimensional integrated circuits; 3DIC; TSV; three dimensional integrated circuit; through silicon vias; Bonding; Etching; Silicon; Three-dimensional displays; Through-silicon vias; Wires; 3-D IC; 3D Integrated Circuit; TSV; Through Silicon Via; Via; interposer;
Conference_Titel :
Energy Aware Computing Systems and Applications (ICEAC), 2013 4th Annual International Conference on
Conference_Location :
Istanbul
DOI :
10.1109/ICEAC.2013.6737650
