DocumentCode
3263625
Title
On Through Silicon Vias as used in three dimensional integrated circuits
Author
Minvielle, Robert ; Bayoumi, M.
fYear
2013
fDate
16-18 Dec. 2013
Firstpage
125
Lastpage
130
Abstract
This paper presents a survey of 3D Integrated Circuits using Through Silicon Vias (TSV). 3D Integrated Circuits and the TSV will be defined, the rationale for moving to these systems will be given, and an overview of the construction of the 3D Integrated Circuit and TSV will be presented. Lastly, the challenges for 3D Integrated Circuits using TSVs will be discussed.
Keywords
three-dimensional integrated circuits; 3DIC; TSV; three dimensional integrated circuit; through silicon vias; Bonding; Etching; Silicon; Three-dimensional displays; Through-silicon vias; Wires; 3-D IC; 3D Integrated Circuit; TSV; Through Silicon Via; Via; interposer;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Aware Computing Systems and Applications (ICEAC), 2013 4th Annual International Conference on
Conference_Location
Istanbul
Type
conf
DOI
10.1109/ICEAC.2013.6737650
Filename
6737650
Link To Document