Title :
Optical coupling of a SMF to flip-chip bonded laser diode for low-cost subscriber´s transmitter module
Author :
Joo, G.C. ; Lee, S.H. ; Moon, J.T. ; Hwang, N. ; Song, M.K. ; Pyun, K.E.
Author_Institution :
Div. of Semicond., Electron. & Telecommun. Res. Inst., Taejon, South Korea
Abstract :
In this paper, we present a noble optical coupling technique for low-cost subscriber´s module in terms of coupling efficiency and its stability issues. For efficient passive integration of a single mode fibre (SMF) and optical devices, silicon submounts were designed to minimize the alignment degree of freedom
Keywords :
flip-chip devices; laser stability; modules; optical fibre couplers; optical fibre subscriber loops; optical transmitters; packaging; semiconductor device packaging; semiconductor lasers; alignment degree of freedom; efficient passive integration; flip-chip bonded laser diode; low-cost subscriber transmitter module; optical coupling; optical devices; silicon submounts; single mode fibre; stability issues; Diode lasers; Electronics packaging; Etching; Optical coupling; Optical devices; Optical fiber devices; Optical transmitters; Silicon; Stability; Wafer bonding;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS '97 10th Annual Meeting. Conference Proceedings., IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3895-2
DOI :
10.1109/LEOS.1997.645301
