Thermal simulation in power electronics

A thermal simulation tool for power components for a coupling between electrical and thermal models is presented. Thermal simulation in steady-state operation (thermal resistance) and dynamic response (transient-thermal resistance) are shown and compared with experiments. This tool, using FLUX 2-D software, allows the thermal behavior of hybrid components to be studied. In steady-state operation, the simulation results are in good agreement with design data as well as with experimental results. However, the interfaces´ designation (soldering joint, copper-ALN interface) must be detailed in order to improve thermal parameter values useful for software inputs. The simulations in dynamic operation seem to be in line with the experimental transient thermal results, except for the short periods of time where the difference of the two results becomes important