Title :
Insulated metal substrates improve in performance and product implementation
Author :
Fishbein, J. ; Abramowitz, H.M.
Author_Institution :
Int. Rectifier Corp., El Segundo, CA, USA
Abstract :
The authors review the insulated metal substrate (IMS) technology and provide comparisons between IMS and ceramic substrates. Results show a reasonable tradeoff in thermal performance with improved consistency resulting from the controlled isolation region. Complexity in packaging adds tradeoffs that still do not make IMS a universal material, but clearly provide advantages over ceramic packages
Keywords :
ceramics; hybrid integrated circuits; integrated circuit testing; packaging; power integrated circuits; ceramic substrates; controlled isolation region; insulated metal substrate; thermal performance; Bonding; Ceramics; Conducting materials; Conductive films; Copper; Insulation; Packaging; Space technology; Substrates; Thick films;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 1992. APEC '92. Conference Proceedings 1992., Seventh Annual
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-0485-3
DOI :
10.1109/APEC.1992.228352
