Title :
Electrocontact microdisplacement testing subsystem
Author :
Zagursky, V. ; Zibinch, Dz
Author_Institution :
Inst. of Electron. & Comput. Sci., Latvian Univ., Riga, Latvia
Abstract :
The subsystem relates to control, testing and measurement instrumentation with closed digital control loop structure. It may be used for testing and measurement of smooth displacements resulting from, for example, force or temperature deformation of an object, or for detection of charges in geometric dimensions of an object while monitoring its airtightness; in particular, when monitoring airtightness of integral microcircuits in cremate packages and watertightness of integral circuits in a watertight case. Also it may be used with some additions for tactile sensing in robotic systems
Keywords :
capacitive sensors; closed loop systems; digital control; displacement measurement; force sensors; microsensors; tactile sensors; airtightness monitoring; closed digital control loop; cremate packages; electrocontact microdisplacement testing; force sensing; integral microcircuit; measurement instrumentation; robotic systems; sensor-transducer; smooth displacements; tactile sensing; testing subsystem; watertightness; Circuit testing; Current measurement; Digital control; Displacement measurement; Force measurement; Instruments; Monitoring; Object detection; Particle measurements; Temperature sensors;
Conference_Titel :
AUTOTESTCON '99. IEEE Systems Readiness Technology Conference, 1999. IEEE
Conference_Location :
San Antonio, TX
Print_ISBN :
0-7803-5432-X
DOI :
10.1109/AUTEST.1999.800404
