• DocumentCode
    3266112
  • Title

    A heuristic for multi-period disassembly leveling and scheduling

  • Author

    Kim, Dong-Hyun ; Lee, Dong-Ho

  • Author_Institution
    Dept. of Ind. Eng., Hanyang Univ., Seoul, South Korea
  • fYear
    2011
  • fDate
    20-22 Dec. 2011
  • Firstpage
    762
  • Lastpage
    767
  • Abstract
    We consider disassembly leveling and scheduling for multiple product types with parts commonality. Disassembly leveling, one of disassembly process planning decisions, is to determine disassembly structures that specify parts and subassemblies to be obtained from used/end-of-life products, and disassembly scheduling is the problem of determining the timing and quantity of disassembling products and their subassemblies to satisfy the demands of their parts and/or subassemblies. Unlike the previous studies, we consider the two problems at the same time, especially in multi-period version for the objective of minimizing the sum of disassembly setup, disassembly operation and inventory holding costs. In particular, we consider the general case that disassembly levels may be different for products of the same type and different periods. To represent the integrated problem mathematically, an integer programming model is developed. Then, as an initial solution approach, a simple greedy heuristic using a priority rule is suggested and its performance is reported.
  • Keywords
    assembling; assembly planning; design for disassembly; integer programming; inventory management; process planning; recycling; scheduling; disassembling product; disassembly operation; disassembly process planning; end-of-life product; greedy heuristic; integer programming model; integrated problem; inventory holding cost; multiperiod disassembly leveling; multiperiod disassembly scheduling; Assembly; Heuristic algorithms; Job shop scheduling; Linear programming; Planning; Process planning; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System Integration (SII), 2011 IEEE/SICE International Symposium on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4577-1523-5
  • Type

    conf

  • DOI
    10.1109/SII.2011.6147544
  • Filename
    6147544