Title :
Combination of MEMS processing and electroless copper plating for a novel RF inductor
Author :
Li, Yi ; Wu, Wengang ; Hao, Yilong
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
Abstract :
A high-performance RF MEMS inductor is fabricated using an improved silicon-glass anodic-bonding and deep etching releasing process combined with electroless copper plating technology, both of which are our new development. The silicon spiral structure of the inductor is suspended over a high-resistance glass substrate with a large gap to the substrate. The silicon spiral structure is encapsulated completely by a plated copper film with good quality by taking advantage of the electroless copper plating technology. The best value of the inductor´s quality factor has reached 27 at the frequency of 9 GHz tested with a network analyzer.
Keywords :
bonding processes; copper; electroless deposited coatings; etching; glass; inductors; micromechanical devices; microwave devices; silicon; substrates; 9 GHz; Cu; MEMS processing; RF inductor; Si; copper film; deep etching releasing process; electroless copper plating; glass substrate; quality factor; silicon spiral structure; silicon-glass anodic-bonding process; Copper; Etching; Glass; Inductors; Micromechanical devices; Radio frequency; Radiofrequency microelectromechanical systems; Silicon; Spirals; Substrates;
Conference_Titel :
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN :
0-7803-8511-X
DOI :
10.1109/ICSICT.2004.1435160
