Title :
Advanced electronic cooling technologies
Author :
Wang, Yanjin ; Luo, Qinghai ; Chen, Xiaoming
Author_Institution :
Univ. of South China, Hengyang, China
Abstract :
This paper introduces the research status of electronic cooling based on the development trend of the electronic technology. The technical characteristics of heat pipes, thermoelectric cooler, phase change cooling and microchannel heat sink are analyzed. These technologies are advanced cooling methods for large power electronic equipments and high heat flux density electronic elements. However, different technique has different advantage and disadvantage. Reasonable selection and optimization of cooling technologies according to the characteristics of cooling objects.
Keywords :
cooling; heat pipes; heat sinks; thermoelectric devices; advanced electronic cooling technologies; electronic technology; heat pipes; high heat flux density electronic elements; large power electronic equipments; microchannel heat sink; phase change cooling; thermoelectric cooler; Electronics cooling; Filling; Heat sinks; Heat transfer; Microchannel; Paper technology; Resistance heating; Temperature; Thermal resistance; Thermoelectricity; electronic cooling; heat pipes; microchannel heat sink; phase change cooling; thermoelectric cooler;
Conference_Titel :
Microelectronics & Electronics, 2009. PrimeAsia 2009. Asia Pacific Conference on Postgraduate Research in
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-4668-1
Electronic_ISBN :
978-1-4244-4669-8
DOI :
10.1109/PRIMEASIA.2009.5397426
