Title :
Silicon-based MEMS process and standardization
Author :
Hao, Yilong ; Zhang, Dacheng
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
Abstract :
This paper, reviewing the development history of MEMS technology, summarizes the developing trend of current MEMS fabrication techniques. To realize the miniaturization and 3D fabrication of MEMS device, multi-layer techniques, SOI techniques and integration are the main developing directions of current MEMS. Standardization is an important tool of MEMS research and the standardization process covers two platforms: the soft platform and the hard platform, which will exert relatively large driving forces to MEMS device research.
Keywords :
elemental semiconductors; integrated circuit technology; micromachining; micromechanical devices; silicon; silicon-on-insulator; standardisation; 3D fabrication; MEMS fabrication techniques; MEMS process standardization; SOI techniques; Si; bulk micromachining; device integration; hard platform standardization; multilayer techniques; silicon-based MEMS process; soft platform standardization; surface micromachining; Bonding; CMOS process; Circuits; Etching; Fabrication; Manufacturing processes; Microelectromechanical devices; Micromachining; Micromechanical devices; Standardization;
Conference_Titel :
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN :
0-7803-8511-X
DOI :
10.1109/ICSICT.2004.1435192
