DocumentCode
3267280
Title
Improving bonding quality in MEMS using silicon/gold/glass bonding by laser
Author
Daohong, Yang ; Chen, Xu ; Linlin, Zhao ; Hui, Zhao ; Wenxiao, Huo ; GuangDi, Shen
Author_Institution
Beijing Optoelectron. Technol. Lab., Beijing Univ. of Technol., China
Volume
3
fYear
2004
fDate
18-21 Oct. 2004
Firstpage
1860
Abstract
A Nd:YAG laser method for fusion bonding between silicon and glass at low temperature has been successfully demonstrated. This method could overcome the damage to movable mechanical parts caused by the electrostatic forces in a MEMS (micro-electronic-machine-system) device during anodic bonding. In addition, it could successfully bond silicon wafer and glass at low temperature, as the Au/Si alloy fusion temperature is 365°C.
Keywords
glass; gold; laser beam welding; laser materials processing; micromechanical devices; silicon; solid lasers; 365 C; Au; MEMS; Si; YAG laser; YAG:Nd; YAl5O12:Nd; anodic bonding; bonding quality; electrostatic forces; fusion bonding; silicon/gold/glass bonding; Glass; Gold; Laser fusion; Laser theory; Micromechanical devices; Neodymium; Plasma temperature; Power lasers; Silicon; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN
0-7803-8511-X
Type
conf
DOI
10.1109/ICSICT.2004.1435198
Filename
1435198
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