Title :
Improving bonding quality in MEMS using silicon/gold/glass bonding by laser
Author :
Daohong, Yang ; Chen, Xu ; Linlin, Zhao ; Hui, Zhao ; Wenxiao, Huo ; GuangDi, Shen
Author_Institution :
Beijing Optoelectron. Technol. Lab., Beijing Univ. of Technol., China
Abstract :
A Nd:YAG laser method for fusion bonding between silicon and glass at low temperature has been successfully demonstrated. This method could overcome the damage to movable mechanical parts caused by the electrostatic forces in a MEMS (micro-electronic-machine-system) device during anodic bonding. In addition, it could successfully bond silicon wafer and glass at low temperature, as the Au/Si alloy fusion temperature is 365°C.
Keywords :
glass; gold; laser beam welding; laser materials processing; micromechanical devices; silicon; solid lasers; 365 C; Au; MEMS; Si; YAG laser; YAG:Nd; YAl5O12:Nd; anodic bonding; bonding quality; electrostatic forces; fusion bonding; silicon/gold/glass bonding; Glass; Gold; Laser fusion; Laser theory; Micromechanical devices; Neodymium; Plasma temperature; Power lasers; Silicon; Wafer bonding;
Conference_Titel :
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN :
0-7803-8511-X
DOI :
10.1109/ICSICT.2004.1435198
