• DocumentCode
    3267383
  • Title

    Comparison of system test alternatives using industry boundary scan standards

  • Author

    Filliter, Kenneth B.

  • Author_Institution
    Nat. Semicond. Corp., South Portland, ME, USA
  • fYear
    1993
  • fDate
    28-30 Sep 1993
  • Firstpage
    176
  • Lastpage
    179
  • Abstract
    High fault coverage embedded system test is a desirable capability in many applications. The test requirement may be for on-line test, remote test capability or for rapid field diagnostics and repair. Two industry standards have recently become available for this purpose. The serial 4 wire IEEE 1149.1 boundary scan standard is widely used for board test and provides interconnect test and device functionality. Although primarily intended as an aid to prototype and manufacturing test, 1149.1 can also be extended over the backplane by the use of commercially available hardware. The proposed IEEE P1149.5 standard is modeled on the DOD´s TM bus and is a fault tolerant, 5-wire, packet based master-slave communications protocol for up to 251 modules. This paper discusses the relative merits of various techniques extending 1149.1 over a backplane. The alternatives are evaluated in terms of test capability and efficiency, fault tolerance and board real estate and component overhead
  • Keywords
    IEEE standards; automatic testing; boundary scan testing; fault diagnosis; protocols; real-time systems; IEEE P1149.5 standard; TM bus; backplane; board real estate; component overhead; embedded system test; fault coverage; fault tolerance; industry boundary scan standards; packet based master-slave communications protocol; rapid field diagnostics; remote test capability; serial 4 wire IEEE 1149.1 standard; system test alternatives; test capability; test efficiency; Backplanes; Communication standards; Embedded system; Fault tolerance; Hardware; Manufacturing industries; Master-slave; Prototypes; System testing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    WESCON/'93. Conference Record,
  • Conference_Location
    San Francisco, CA
  • ISSN
    1095-791X
  • Print_ISBN
    0-7803-9970-6
  • Type

    conf

  • DOI
    10.1109/WESCON.1993.488430
  • Filename
    488430