• DocumentCode
    3267566
  • Title

    A boosted dual world-line decoding scheme for 256 Mb DRAMs

  • Author

    Noda, K. ; Saeki, T. ; Tsujimoto, A. ; Murotani, T. ; Koyama, K.

  • Author_Institution
    NEC Corp., Kanagawa, Japan
  • fYear
    1992
  • fDate
    4-6 June 1992
  • Firstpage
    112
  • Lastpage
    113
  • Abstract
    A boosted dual word-line decoding scheme with regulated power supply is developed to realize a memory cell applicable to 256 Mb DRAMs by using silicon dioxide as a dielectric material, and without area increase of the memory cell array. The scheme relaxes the wiring pitch on the cell array, thus making it easier to realize wiring patterns in the large step environment caused by the stack capacitor thickness. A capacitance of up to 50 fF can be realized for a dual cylindrical structure with 1 mu m height and 5 mm oxid thickness. The scheme yields word rising operations two times faster than conventional approaches.<>
  • Keywords
    DRAM chips; decoding; driver circuits; power supply circuits; 256 Mbit; 50 fF; DRAMs; SiO/sub 2/ dielectric; boosted dual world-line decoding scheme; dual cylindrical structure; large step environment; memory cell; regulated power supply; stack capacitor thickness; wiring patterns; wiring pitch; word rising operations; Capacitors; Decoding; Dielectric materials; Driver circuits; Power supplies; Random access memory; Silicon compounds; Very large scale integration; Voltage; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Circuits, 1992. Digest of Technical Papers., 1992 Symposium on
  • Conference_Location
    Seattle, WA, USA
  • Print_ISBN
    0-7803-0701-1
  • Type

    conf

  • DOI
    10.1109/VLSIC.1992.229266
  • Filename
    229266