• DocumentCode
    3267706
  • Title

    An overview of the NIST ATP precision optoelectronics assembly consortium program

  • Author

    Witham, Carl R. ; Beranek, Mark W. ; Bolles, Robert C. ; Carlisle, Brian R. ; Caudill, Reggie J. ; Chang, Timothy N. ; Lang, Robert J. ; Ortyl, Nicholas E. ; Rust, Ray D.

  • Author_Institution
    Adept Technol. Inc., San Jose, CA, USA
  • Volume
    2
  • fYear
    1997
  • fDate
    10-13 Nov 1997
  • Firstpage
    272
  • Abstract
    Under the NIST ATP-sponsored “precision optoelectronics assembly” program, Adept Technology, Boeing, Dresser Industries, National Center for Manufacturing Sciences, New Jersey Institute of Technology, SDL, and SRI International, are collaboratively developing key enabling technologies for low-cost, flexible, automated assembly of optoelectronics systems. Midway through the program the Consortium has developed a prototype assembly platform. Precision optoelectronics assembly processes for beta-site testing have been defined
  • Keywords
    automation; computer vision; integrated circuit technology; integrated optoelectronics; measurement errors; optical fabrication; optoelectronic devices; Adept Technology; Boeing; Dresser Industries; NIST ATP precision optoelectronics assembly consortium program; National Center for Manufacturing Sciences; New Jersey Institute of Technology; SDL; SRI International; beta-site testing; key enabling technologies; low-cost flexible automated optoelectronic systems assembly; overview; precision optoelectronics assembly; precision optoelectronics assembly processes; Aerospace industry; Assembly systems; Bonding; Manufacturing automation; Manufacturing industries; NIST; Project management; Robotic assembly; Robotics and automation; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS '97 10th Annual Meeting. Conference Proceedings., IEEE
  • Conference_Location
    San Francisco, CA
  • ISSN
    1092-8081
  • Print_ISBN
    0-7803-3895-2
  • Type

    conf

  • DOI
    10.1109/LEOS.1997.645414
  • Filename
    645414