Title :
Hybrid integration for low-cost OE packaging and PLC transceiver
Author :
Henein, G.E. ; Muehlner, D.J. ; Shmulovich, J. ; Gomez, L. ; Capuzzo, M.A. ; Laskowski, E.J. ; Yang, R. ; Gates, J.V.
Author_Institution :
Lucent Technol., Bell Labs., Murray Hill, NJ, USA
Abstract :
We will describe in this paper a technology to integrate all the optical functions on one single piecepart, the planar lightguide circuit (PLC), departing from the traditional approach of separately packaged transmitter (Tx) and receiver (Rx). The rationale is that the increase in complexity/cost incurred at wafer-scale processing is, in large volume (>100k/yr), greatly outweighed by the reduction in the final number of pieceparts/assembly cost, resulting in a net lowering of the overall cost of the optical network unit
Keywords :
integrated circuit packaging; integrated optoelectronics; optical receivers; optical transmitters; transceivers; PLC transceiver; assembly cost; complexity; cost; hybrid integration; large volume; low-cost OE packaging; optical functions; optical network unit; piecepart; planar lightguide circuit; wafer-scale processing; Assembly; Circuits; Costs; Integrated optics; Optical network units; Optical receivers; Optical transmitters; Packaging; Programmable control; Transceivers;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS '97 10th Annual Meeting. Conference Proceedings., IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3895-2
DOI :
10.1109/LEOS.1997.645432
