DocumentCode :
3268346
Title :
Overview: trends in prototype board fabrication
Author :
Spadaro, Joseph J.
Author_Institution :
Intertec Publishing Co., White Plains, NY, USA
fYear :
1993
fDate :
28-30 Sep 1993
Firstpage :
466
Lastpage :
469
Abstract :
Regardless of whether an OEM follows traditional or concurrent engineering product development paths, sooner or later one or more prototype circuit boards must be built. And of the three major stages in the creation of a prototype circuit board-namely design, assembly and test-this session will focus on their assembly, as this stage is undergoing considerable technological change. The change is being driven by four major trends. First, is the need to create boards quickly to cut time-to-market. Secondly, are circuit-performance issues. Third are environmental issues surrounding the use of hazardous chemicals used for etching boards. And fourth is the steadily expanding use of surface-mount components
Keywords :
assembling; environmental factors; etching; printed circuit manufacture; product development; surface mount technology; OEM; assembly; circuit-performance issues; concurrent engineering product development; environmental issues; etching; hazardous chemicals; prototype board fabrication; surface-mount components; time-to-market; Assembly; Chemical hazards; Chemical technology; Circuit testing; Concurrent engineering; Fabrication; Printed circuits; Product development; Prototypes; Time to market;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
WESCON/'93. Conference Record,
Conference_Location :
San Francisco, CA
ISSN :
1095-791X
Print_ISBN :
0-7803-9970-6
Type :
conf
DOI :
10.1109/WESCON.1993.488479
Filename :
488479
Link To Document :
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