DocumentCode
3268346
Title
Overview: trends in prototype board fabrication
Author
Spadaro, Joseph J.
Author_Institution
Intertec Publishing Co., White Plains, NY, USA
fYear
1993
fDate
28-30 Sep 1993
Firstpage
466
Lastpage
469
Abstract
Regardless of whether an OEM follows traditional or concurrent engineering product development paths, sooner or later one or more prototype circuit boards must be built. And of the three major stages in the creation of a prototype circuit board-namely design, assembly and test-this session will focus on their assembly, as this stage is undergoing considerable technological change. The change is being driven by four major trends. First, is the need to create boards quickly to cut time-to-market. Secondly, are circuit-performance issues. Third are environmental issues surrounding the use of hazardous chemicals used for etching boards. And fourth is the steadily expanding use of surface-mount components
Keywords
assembling; environmental factors; etching; printed circuit manufacture; product development; surface mount technology; OEM; assembly; circuit-performance issues; concurrent engineering product development; environmental issues; etching; hazardous chemicals; prototype board fabrication; surface-mount components; time-to-market; Assembly; Chemical hazards; Chemical technology; Circuit testing; Concurrent engineering; Fabrication; Printed circuits; Product development; Prototypes; Time to market;
fLanguage
English
Publisher
ieee
Conference_Titel
WESCON/'93. Conference Record,
Conference_Location
San Francisco, CA
ISSN
1095-791X
Print_ISBN
0-7803-9970-6
Type
conf
DOI
10.1109/WESCON.1993.488479
Filename
488479
Link To Document