• DocumentCode
    3268346
  • Title

    Overview: trends in prototype board fabrication

  • Author

    Spadaro, Joseph J.

  • Author_Institution
    Intertec Publishing Co., White Plains, NY, USA
  • fYear
    1993
  • fDate
    28-30 Sep 1993
  • Firstpage
    466
  • Lastpage
    469
  • Abstract
    Regardless of whether an OEM follows traditional or concurrent engineering product development paths, sooner or later one or more prototype circuit boards must be built. And of the three major stages in the creation of a prototype circuit board-namely design, assembly and test-this session will focus on their assembly, as this stage is undergoing considerable technological change. The change is being driven by four major trends. First, is the need to create boards quickly to cut time-to-market. Secondly, are circuit-performance issues. Third are environmental issues surrounding the use of hazardous chemicals used for etching boards. And fourth is the steadily expanding use of surface-mount components
  • Keywords
    assembling; environmental factors; etching; printed circuit manufacture; product development; surface mount technology; OEM; assembly; circuit-performance issues; concurrent engineering product development; environmental issues; etching; hazardous chemicals; prototype board fabrication; surface-mount components; time-to-market; Assembly; Chemical hazards; Chemical technology; Circuit testing; Concurrent engineering; Fabrication; Printed circuits; Product development; Prototypes; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    WESCON/'93. Conference Record,
  • Conference_Location
    San Francisco, CA
  • ISSN
    1095-791X
  • Print_ISBN
    0-7803-9970-6
  • Type

    conf

  • DOI
    10.1109/WESCON.1993.488479
  • Filename
    488479