DocumentCode :
3268480
Title :
Dynamic temperature-aware task scheduling based on sliding window model for MPSoCs
Author :
Wang, Luguang ; Jia, Zhiping ; Li, Xin ; Li, Yang ; Qiu, Meikang
Author_Institution :
Sch. of Comput. Sci. & Technol., Shandong Univ., Jinan, China
fYear :
2011
fDate :
18-20 Jan. 2011
Firstpage :
98
Lastpage :
103
Abstract :
As the power density of modern chips increases drastically, chips are prone to overheating. Thermal hot spots increase cooling costs, negatively impact reliability and degrade performance. A valid task scheduling can reduce chip´s average temperature and temperature variations. We propose a dynamic temperature-aware task scheduling policy based on sliding window model. This scheduling policy calculates the probability of task allocation for each core according to current and historical temperatures of the core, and then the one with the maximal probability is chosen to execute the ready task. If multiple cores have the same probability, the scheduler gives priority to the core that has the minimal average temperature of neighbor units. The experimental results show that this scheduling policy can reduce hot spots, decrease spatial and temporal temperature variations of all units, and thus achieve a relatively lower average temperature and more balanced temperature distribution.
Keywords :
microprocessor chips; multiprocessing systems; probability; reliability; system-on-chip; MPSoC; balanced temperature distribution; chip average temperature; dynamic temperature-aware task scheduling; maximal probability; multiprocessor systents-on-chip; power density; sliding window model; task allocation; temperature variation; thermal hot spot; Voltage control; HotSpot; multicore task scheduling; multiprocessor systems-on-chips (MPSoCs); sliding window; temperature-aware;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Computer Control (ICACC), 2011 3rd International Conference on
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-8809-4
Electronic_ISBN :
978-1-4244-8810-0
Type :
conf
DOI :
10.1109/ICACC.2011.6016375
Filename :
6016375
Link To Document :
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