DocumentCode :
3268551
Title :
Rule-Based Inspection of Wafer Surface
Author :
Shankar, N.G. ; Zhong, Z.-W.
Author_Institution :
Euro Technology Pte Ltd, Tech Place 1, Singapore 569628
fYear :
2003
fDate :
12-12 June 2003
Firstpage :
752
Lastpage :
755
Abstract :
A template-based vision system for the 100% inspection of wafer die surfaces has been developed. Design goals included a requirement for the detection of flaws as small as 1μm on parts up to 8-inch wafer size. Each die is treated as one part of the whole wafer. One of the good dies is trained and kept as template die for the whole wafer. The die physical location data are generated, before hand, from CAD designs using a wafer map editor (WME). A separate software package called the wafer map editor was developed to generate setup data needed during the runtime of the inspection process. The WME also generates a part defect wafermap. Each unique die pattern in the wafer is defined as an object and these objects are grouped into userdefined categories such as good die pads and defect die pads. The defect wafer map is used during the runtime inspection of die attach to avoid picking of bad die pads.
Keywords :
Automation; Defect detection; Image processing; Pattern recognition; Rule-Based; Semiconductor; Yield enhancement; Automation; Defect detection; Image processing; Pattern recognition; Rule-Based; Semiconductor; Yield enhancement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Control and Automation, 2003. ICCA '03. Proceedings. 4th International Conference on
Conference_Location :
Montreal, Que., Canada
Print_ISBN :
0-7803-7777-X
Type :
conf
DOI :
10.1109/ICCA.2003.1595123
Filename :
1595123
Link To Document :
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